What is Electronic Encapsulation?

Electronic encapsulation is a process that protects electrical components from the environment. Materials such as potting compound, epoxy, or silicone can do this.

Electronic encapsulation involves protecting an electronic assembly with a compound to defend it from corrosion shock and vibration. Encapsulation, in comparison to conformal coating, the former is thicker and robust than the latter to guard your electronic assemblies against various harsh environments and tin whiskers.

It is helpful to keep them at optimal functioning levels for longer periods. Encapsulating components also protect electronic and electrical components from various security threats, such as reverse engineering or tampering.

Why is Electronic Encapsulation Used in PCB Assembly?

Conformal coatings provide a thin barrier to protect electronic devices from harsh environmental conditions; however, encapsulants are applied on the entire assembly, increasing protection for each component. Encapsulated electronic components, such as flip-chips and semiconductor die chips, are shielded from environmental stresses, mechanical vibration, and contamination.

The encapsulation process neutralizes the Coefficient of Thermal Expansion to prevent it from developing into a thermal or dimensional problem. These materials also improve the insulation of individual components, which minimizes current loss.

Encapsulants protect individual items from the harsh exterior environment, such as capacitors, diodes, and integrated circuits (IC), which rely on encapsulation to maintain their integrity. Most encapsulants should retain ionic purity, be moisture-resistant, thermally cyclable invulnerable, and possess a low shrinkage modulus. Flexibility and low shrink are vital to the encapsulant, as it also functions as part of a strain relief system for wire leads. Electronic encapsulation lowers the stress on wires and minimizes the risk of them breaking.

Benefits of Encapsulation of Printed Circuit Boards

• It offers complete protection against shock and water damage.
• Encapsulation provides a secure seal, which prevents the entry of contaminants.
• Encapsulation protects against corrosion and chemicals.
• It is also an effective way to reduce EMI/RFI interference in devices.
• Encapsulated electronic components offer a solid foundation for wire bonding by reducing stresses on solder joints that may lead to breakage or failure. The elimination of exposed copper edges provides less surface area for oxidation and promotes better adhesion between wires and solder pads, and improved thermal performance.
• It prevents components from being damaged or destroyed due to external forces, such as mechanical vibration.
• Encapsulation protects against the harmful effects of tin whiskers (a form of electrochemical corrosion) by providing an environmental barrier to them.
• Encapsulated PCBs are also more difficult to reverse-engineer than those with a conformal coating applied only on select regions.
• It ensures optimal device functionality over time; it improves insulation between electrical devices to minimize current loss.
• It also protects individual components from thermal expansion issues while retaining ionic purity and moisture resistance properties.
• Encapsulation is generally less expensive and faster than other protective methods because it requires fewer application steps and does not require a re-assembly process.
• It has VOC-free options.
• Encapsulation and potting material are easy to use, even in high-volume applications.

Applications of Encapsulation

Encapsulation has a wide range of applications ranging from photonics encapsulation to being used in cables. Below we have included the following applications, among others:

PCB Encapsulation

As discussed, encapsulants are used to protect electronic components such as Printed Circuit Boards (PCBs), which may be susceptible to damage from mechanical vibration, moisture, or other environmental factors.

Photonics Encapsulation

Encapsulated components are used in applications varying from fiber optics to solar panels and photonic integrated circuits to manufacture LEDs.

Optical instrument enclosures can benefit from using electronic encapsulants. They protect optical elements from corrosion and prevent dust particles and humidity from interfering with their performance.

Liquid Crystal Displays (LCDs) also require defense against light interference due to ultraviolet radiation. Therefore, they should be encased within an encapsulant material that blocks UV rays while maintaining a clear viewable surface area.

Protects Electrical and Electronic Components

This is another application of potting and encapsulation. It protects electrical and electronic components from water, dirt, dust, or other contaminants.

Sensor Assemblies

Encapsulation is used in sensor assemblies to protect sensitive electronic components from contaminants and vibration.

Power Supplies

While not as common, encapsulants are also used in power supplies to protect from corrosion and contamination. It also prevents the power supply from overheating.

Transformers

Encapsulants are also used in transformers to shelter against corrosion and contamination.

Cables

Encapsulants are sometimes used on electrical cables such as coaxial or twisted pairs. They may be vulnerable to damage from oxidation and other environmental factors. 

It even protects the wires inside it from being exposed to moisture, sunlight, chemicals, or potential contaminants where they could cause problems with performance over time.

This application can help reduce maintenance costs by prolonging device lifespan. It will also help keep more devices functioning at any given time while reducing downtime and repairing expenses.

Materials Required for the Encapsulation Process

There are various materials required for the encapsulation process, including resins, adhesives, and potting compounds.

Resins coat electronic devices during electronic assembly to protect them from water or other environmental contaminants. Adhesives may be needed when attaching the encapsulating material around a device for protection purposes.

The potting compound is used as an additional layer of protection on electrical components that cannot have any liquid applied, such as printed circuit boards (PCBs). It also helps with heat dissipation by conducting away excess thermal energy created during operation. This prevents temperatures from rising beyond normal ranges, which can lead to component failure over time.

Potting materials usually come in two types: silicone-based or epoxy-based resins. The decision will depend on application requirements like voltage level, heat resistance, environmental protection, and service life.

The Answer is Geospace Technologies 

Geospace Technologies is more than capable of handling all your PCB assembly and electronic encapsulation needs. As a PCB assembly manufacturer, our Printed Circuit Board assembly services and Surface Mount Technology provide the top-tier capabilities, you demand. Now that you know everything about electronic encapsulation needs contact us today to receive a quote on all your electronic manufacturing services. Remember, the answer is always Geospace Technologies.